XJYYB-25系列鍍金銅箔，基材為軟態壓延銅箔 gt;99.9%純銅），基材具有良好的導電性，鍍金表面電接觸性能 優良且具備 的抗電化學腐蝕性，易釬焊。
根據客戶需求，我司同時可以生產鍍錫，鍍銀等其他金屬鍍層滿足特殊應用，銅箔厚度10-100微米，幅寬 達到540mm.
XJYYB-25Series gold plated copper foil, base material is Rolled temper pure copper foil (>99.9% Copper), The foil not only function excellent electricity, thermal conductivity of copper but also performing very good electricity contacting, excellent electro-chemical compatibility, high Corrosion resistance, and very easy for soldering process.
幅寬Width | 520±10mm | 卷尺測量Tape measurement |
卷長Length | 200m/Roll | 卷尺測量Tape measurement |
顏色Color | 金色Gold Yellow | 目測Visual |
總厚度Total Thickness | 26µm±10% | ASTM D1000 |
銅箔厚Copper Foil Thickness | 25µm±10% | ASTM D1000 |
鍍金層厚度Gold Coating | 0.04µm±0.01 | ASTM D1000 |
鍍層結合力Cotaing Bonding Str | 5B | 內部標準Inside Standard |
方阻Surface Resistance | ≤0.02Ω/? | Test by MIL-G-83528 |
鹽霧測試Salt spray test | 24Hrs | ASTM B117-2003 |
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