XJYYB12系列鍍金銅箔，基材為軟態壓延銅箔 gt;99.9%純銅），基材具有良好的導電性，鍍金表面電接觸性能 優良且具備 的抗電化學腐蝕性，易釬焊。

根據客戶需求，我司同時可以生產鍍錫，鍍銀等其他金屬鍍層滿足特殊應用，銅箔厚度10-100微米，幅寬 達到540mm.

Series gold plated copper foil, base material is Rolled temper pure copper foil (>99.9% Copper), The foil not only function excellent electricity, thermal conductivity of copper but also performing very good electricity contacting, excellent electro-chemical compatibility, high Corrosion resistance, and very easy for soldering process.